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 CCD Area Image Sensor
MN39116AT
Diagonal 4.5 mm (type-1/4) 270k-pixel CCD Area Image Sensor
Overview
The MN39116AT is a 4.5 mm (type-1/4) interline transfer CCD (IT-CCD) solid state image sensor device. This device uses photodiodes in the optoelectric conversion section and CCDs for signal readout. The electronic shutter function has made an exposure time of 1/10 000 seconds possible. Further, this device has the features of high sensitivity, low noise, broad dynamic range, and low smear. This device has a total of 267 206 pixels (542 horizontal x 493 vertical) and provides stable and clear images with a resolution of 360 horizontal TV-lines and 350 vertical TV-lines. Part Number Size System Color or B/W EIA B/W
(Top View)
Pin Assignments
VDD R RD VO LG H2 H1
1 2 3 4 5 6 7
14 13 12 11 10 9 8
PW V4 V3 V2 V1 PT Sub
MN39116AT 4.5 mm (type-1/4)
Features
* Effective pixel number 512 (horizontal) x 491 (vertical) * High sensitivity * Broad dynamic range * Low smear * Electronic shutter
Applications
* Surveillance cameras * FA, OA cameras
Publication date: May 2003
SMD00008CEC
1
MN39116AT
Block Diagram
(2 columns OB + 512 columns valid area + 28 columns OB)
(2 dummies + OB1 + valid area 491 + OB1 + 1 dummy)
13
Sub (Internal connection) GND LG
14
V4 12 V3 11 10
V2
V1
14 5
Photo diode
VO VDD GND
4 1 3
Output section
Vertical shift register
8 9
Horizontal shift register (Top 6 dummies)
Sub PT
2
6 H2
Pin No. Symbol 8 9 10 11 12 13 14 Sub PT V1 V2 V3 V4 PW Substrate P-well Value 512 x 491 3.614 4 x 2.716 7.2 x 5.6 Unit pixel mm2 m2
SMD00008CEC
Pin Descriptions
Pin No. Symbol 1 2 3 4 5 6 7 VDD R RD VO LG H2 H1 Description Power supply Reset pulse (RG) Reset drain Video output Output load transistor gate Horizontal register clock pulse 2 Horizontal register clock pulse 1 Description
P-well for protection circuit Vertical shift register clock pulse 1 Vertical shift register clock pulse 2 Vertical shift register clock pulse 3 Vertical shift register clock pulse 4
Device Parameter (H x V)
Parameter Pixel number
*
Image sensing block dimension Pixel dimension
Note) *: OB columns are not included.
2
H1
R
7
MN39116AT
Absolute Maximum Ratings and Operating Conditions
Absolute maximum rating Parameter VDD VRD VPT
*3, 4
Operating condition Min 14.5 14.5 -8.3 Typ 15.0 15.0 -8.0 0 Max 15.5 15.5 -7.7 Unit V V V V V V 3.3 5.3 V V 3.3 0 3.3 0 5.3 0.05 5.3 0.05 V V V V V 23.0 15.0 0 -8.0 0 -8.0 15.0 0 -8.0 0 -8.0 25 23.5 15.5 0.2 -7.7 0.2 -7.7 15.5 0.2 -7.7 0.2 -7.7 V V V V V V V V V V V C C
Lower limit - 0.2 - 0.2 -10.0
Upper limit 18.0 18.0 0.2
GND VLG VOG VR VH1 VH2 VSub
*2 *1 *6
(Referene voltage)
(Supplied internally) (Supplied internally) High-Low Bias High Low High Low - 0.2 - 0.2 - 0.2 High Middle Low -9.0 -9.0 -9.0 -9.0 -10 -30 8.0 8.0 8.0 3.0 (Supplied internally) 3.0 - 0.05 3.0 - 0.05 (Supplied internally) 45.0 18.0 15.0 18.0 15.0 60 80 22.5 14.5 - 0.2 -8.3 - 0.2 -8.3 14.5 - 0.2 -8.3 - 0.2 -8.3
VSub VV1
*3, 4, 5
VV2 VV3
*3, 4, 5
Middle Low
*3, 4, 5
High Middle Low
VV4
*3, 4, 5
Middle Low
Operating temperature Storage temperature
Note) 1. Standard photo detecting condition Standard photo detecting condition stands for detecting image with a light source of color temperature of 2 856K, luminance of 1 050 cd/m2, and using a color temperature conversion filter LB-40 (HOYA), infrared cut filter CAW-500S with thickness 2.5 mm for a light path and with F8 lens aperture. The quantity of the incidental light to a photo-detecting surface under the above condition is defined as the standard quantity of light. 2. *1: VSub when using electronic shutter function
VSub H VSub (V) VSub L GND VSub (V) (Supplied internally)
SMD00008CEC
3
MN39116AT
Absolute Maximum Ratings and Operating Conditions (continued)
Note) 2. *2: VSub supplied internally is the voltage suppressing the blooming generation at x1 000 light quantity relative to the standard light quantity. *3: Relation between VPT and VVL Set VPT under the following condition against VL of a vertical transfer clock waveform. VPT VL (VV1L to VV4L) *4: Absolute maximum ratings - 0.2 < VSub - VPT < 55 (V) - 0.2 < VV - VPT < 24.5 (V) *5: Ground LG pin with the capacitor of 0.047 F or more. Ground R pin with the capacitor of 1 M.
Optical Characteristics
Parameter S/N ratio (dark) Sensitivity Saturation output Vertical smear Symbol S/Nd So Sc Sm Conditions Dark condition J chart F8 Saturation maximum output 1/10 V chart, F2.8 Min 58 480 700 Typ 60 650 900 Max 0.01 Unit dB mV mV %
Graph of Characteristics
CCD spectral characteristics
1.2
1
0.8
Relative sensitivity
0.6
0.4
.02
0 400
500
600
700
800
Wavelength (nm)
4
SMD00008CEC
MN39116AT
Timing Diagram
* High speed pulse timing
H2
50%
50%
50%
52 ns 3 ns
CCD output
R
50%
50%
-2 ns 10 ns
21 ns 3 ns
Clamp pulse (DS1)
50%
50%
8 ns 5 ns
26 ns 3 ns
Sampling pulse (DS2)
50%
50%
8 ns 5 ns
26 ns 3 ns
SMD00008CEC
5
MN39116AT
Timing Diagram (continued)
* Rise time and fall time of each pulse
V1 , V3
0.9
0.9
0.1 0.9
0.1 0.9
0.1 300 ns V2 , V4 300 ns 300 ns
0.1 300 ns
0.9
0.9
0.1 300 ns H1 , H2 , R 0.9 0.9
0.1 300 ns DS1, DS2
0.9
0.9
0.1 10 ns
0.1 10 ns
0.1 10 ns
0.1 10 ns
6
SMD00008CEC
MN39116AT
Package Dimensions (unit: mm)
* WDIP014-P-0400F
10.000.08 9.000.10 5.000.08 14
Reference plane 8
5.000.08 9.000.10
10.000.08
0.015
Valid pixel center
(0.80)
(0.60)
3.500.20
(1.19)
1.27
0.300.05
1.300.10
0.3 M
1
7
2-R0.40 (Depth 0.30)
1. The center of the package is equal to the center of the effective pixel area. 2. The rotation angle of the effective pixel area: up to 1.0 degree 3. The distance from the bottom face of the package to the surface of the effective pixel area: 1.69 mm 0.10 mm 4. The tilt of the effective pixel area for the bottom face of the package: up to 25 m 5. Thickness of seal glass is 0.8 mm, and the refractive index is 1.50. 6. Package weight: 0.65 g (typ.)
(2.50)
14
8
3.400.15
(1.30)
0.250.05
1
7
10.160.25
SMD00008CEC
7
Request for your special attention and precautions in using the technical information and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) We are not liable for the infringement of rights owned by a third party arising out of the use of the product or technologies as described in this material. (4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: * Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. * Any applications other than the standard applications intended. (5) The products and product specifications described in this material are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.
2002 JUL


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